MEB Micro Edgeboard
Application / Market:
Series:
Our MEB microminiature edgeboard connector series offers a combination of high density and high reliability for applications in aerospace systems, computers and peripherals and industrial-based commercial control systems. This series incorporates the proven MicroPinTM / MicroSocketTM contact for high reliability. It features machined aluminum shells for ruggedness, diallyl phthalate insulator for topelectrical performance and a 36-position polarization key system to prevent cross plugging.
Features
- 0.050 Contact spacing
- Cannon twist pin contact system
- Rugged, machined aluminum shells
- Key polarization to prevent cross plugging
- Diallyl phthalate insulator for top electrical performance
- Terminiation types include 90° or right angle pigtail for multi-layered P.C. boards, "coke bottle” termination for double-sided PC boards
- Harnessing capability available for both pin and socket sides
Searching for part specs, 2D drawings, 3D models (when available) or available stock?
Resources
Nano Microminiature Connectors Catalog
Ultra-High Temp Micro-MDM Sell Sheet
High Temp Micro MDM Brochure
MIL-DTL 83513 Microminature Connector Sell Sheet
Microminiature Connectors Catalog
Combo-D Catalog
Product Specification
Environmental
Sealing | N/A |
Operation Temperature | -65°C to +125°C |
Mechanical
Shape | D Shape |
Shell Style | Straight Flange mount, Straight and Right angle PCB mount |
Durability | 500 Mating Cycles |
Power & Signal In Same Layout | No |
Contact Style / Termination | Factory terminated wire, Solder pots, PC tails |
Electrical
Operating Voltage | 500 VAC |
Dielectric with Standing Voltage | 800 VAC at sea level, 200 VAC at 70,00' altitude |
Current Rating | 3A |
Number of Signal Contacts (MIN/MAX) | 64, 92, 128, 184 |
Gauge Wire Size | AWG 24 thru AWG 30 |
Material
Shell | Aluminum Alloy |
Shell Plating | Electroless Nickel |
Insulator | Glass filled diallyl phthalate per MIL-M-14. Type SDG-F |
Contact | Copper alloy |
Contact Plating | Gold |