MOVE-MOD™ Series - Ultimate in modularity and flexibility by utilizing a range of snap in modules.
NDD M32139-Style Nano D
Our NDD M32139-style Nano-D is a small form factor, high density interconnect designed and manufactured for high reliability and harsh environment applications. These interconnects are ideal when size and weight limitations require an ultra low profile and robust design package. Utilizing our innovative twist pin contact system on 0.025 contact spacing and 5 points of electrical contact, the NDD series offers an extremely rugged small form factor interconnect solution. Typical applications include military avionics, oil & gas industry exploration and missile systems.
- Micro twist Pin contact system
- 0.025" contact spacing
- 1 amp contact rating
Searching for part specs, 2D drawings, 3D models (when available) or available stock?
Nano Microminiature Connectors Catalog
|Shell Style||Straight Flange mount Plug, Straight Flange mount Receptacle, Right angle PCB mount Plug, Right angle PCB mount receptacle|
|Durability||500 Mating Cycles|
|Power & Signal In Same Layout||No|
|Contact Style / Termination||Factory terminated stranded wire, Factory terminated solid wire|
|Operation Temperature||-55°C to +125°C (+200°C)|
|Shell Plating||Electroless Nickel, Yellow Chromate/Cadmium over nickel|
|Insulator||Liquid Crystal Polymer (LCP)|
|Operating Voltage||150 VAC|
|Dielectric with Standing Voltage||350 VAC at sea level, 100 VAC at 70,00' altitude|
|Number of Signal Contacts (MIN/MAX)||9, 15, 21, 25, 31, 37, 51|
|Gauge Wire Size||AWG 30 & AWG 32|