HDx Series- High-Density, Small Form Factor

ITT Cannon’s HDxTM Series offers a reliable, small form factor (SFF) solution in a lightweight, compact design. With breakaway or screw-lock breakaway coupling options, this high-density interconnect enables critical USB, HDMI or Ethernet high-speed data transmission. 

Cannon’s HDx Series comes in an anti-glare, non-reflective Ruthenium plating and is rated up to 20 meter sealing depth when mated. This combined with it’s high durability rating, provide end users with a dependable interconnect system in any mission critical  situation.  

Features

  • Lightweight, compact design
  • Ultra-high density layouts
  • Signal & power configurations
  • Support high speed data - USB® 3.1 Gen1 up to 5Gbit/s, Ethernet up to 10Gbit/s, HDMI® up to 8.16 Gbit/s
  • Watertight sealing up to 20 meter depth
  • High-durability with 5,000 mating cycles
  • Anti-glare, non-reflective plating
  • Break-away or Threaded Locking Options

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Resources

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HDx Series

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HDx Series- High Density Small Form Factor Sell Sheet

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ITT Cannon Soldier-Worn Solutions Guide

Product Specification

Environmental

Sealing

High Pressure Sealing 20+ Meters

Operation Temperature

-51°C to +125°C

Mechanical

Shell Style

Circular - In-line and Rear Panel Mount

Durability

5000 mating cycles @ ambient temperature 

Power & Signal In Same Layout

Contact Factory for Application Requirements

Contact Style / Termination

Printed Circuit, Solder Cup

Material

Shell

Brass

Insulator

Ruthenium over Electroless Nickel Plating

Contact

Copper Alloy

Contact Plating

Gold over Nickel Plating

Electrical

Operating Voltage

250 VDC

Current Rating

Ø0.3mm Contacts: 1 Amp Max (Single Contact)

Ø0.7mm Contacts: 5 Amps (Single Contact)

Number of Signal Contacts (Min/Max)

9, 12, 16 - Consult Factory for Additional Configurations

Gauge Wire Size

#22 - #28 AWG, Layout dependent: Ø0.3mm Solder Contacts: 28 AWG and  Ø0.7mm Solder Contacts: 22 AWG

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