MOVE-MOD™ Series - Ultimate in modularity and flexibility by utilizing a range of snap in modules.
HDx Series- High-Density, Small Form Factor
ITT Cannon’s HDxTM Series offers a reliable, small form factor (SFF) solution in a lightweight, compact design. With breakaway or screw-lock breakaway coupling options, this high-density interconnect enables critical USB, HDMI or Ethernet high-speed data transmission.
Cannon’s HDx Series comes in an anti-glare, non-reflective Ruthenium plating and is rated up to 20 meter sealing depth when mated. This combined with it’s high durability rating, provide end users with a dependable interconnect system in any mission critical situation.
- Lightweight, compact design
- Ultra-high density layouts
- Signal & power configurations
- Support high speed data - USB® 3.1 Gen1 up to 5Gbit/s, Ethernet up to 10Gbit/s, HDMI® up to 8.16 Gbit/s
- Watertight sealing up to 20 meter depth
- High-durability with 5,000 mating cycles
- Anti-glare, non-reflective plating
- Break-away or Threaded Locking Options
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HDx Series- High Density Small Form Factor Sell Sheet
ITT Cannon Soldier-Worn Solutions Guide
High Pressure Sealing 20+ Meters
-51°C to +125°C
Circular - In-line and Rear Panel Mount
5000 mating cycles @ ambient temperature
|Power & Signal In Same Layout||
Contact Factory for Application Requirements
|Contact Style / Termination||
Printed Circuit, Solder Cup
Ruthenium over Electroless Nickel Plating
Gold over Nickel Plating
Ø0.3mm Contacts: 1 Amp Max (Single Contact)
Ø0.7mm Contacts: 5 Amps (Single Contact)
|Number of Signal Contacts (Min/Max)||
9, 12, 16 - Consult Factory for Additional Configurations
|Gauge Wire Size||
#22 - #28 AWG, Layout dependent: Ø0.3mm Solder Contacts: 28 AWG and Ø0.7mm Solder Contacts: 22 AWG